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robot(xy axis) - List of Manufacturers, Suppliers, Companies and Products

robot Product List

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Wafer transport robot for vacuum environments "UT-VDX3000NS series"

Equipped with a direct drive motor for wafers up to 300mm! A high-precision single-arm vacuum robot that significantly reduces vibration.

- By incorporating a direct drive motor and a steel belt within the arm, ultra-high precision transport and significant vibration reduction during arm operation are achieved. - The adoption of a partition-type vacuum seal allows for compatibility in ultra-high vacuum environments. - The endless specification of the swivel axis improves the throughput of the device. - The built-in controller enables miniaturization of the device. - Equipped with a wafer center position deviation correction function. *For more details, please refer to the PDF document or feel free to contact us.

  • Transport and handling robots

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Atmospheric Environment Wafer Transport Robot 'UTX/W-RF5501RW'

【For wafers up to 300mm】 Usable in processes that handle moisture! A drip-proof model wafer transport robot that achieves protection class IP64.

■Achieves protection level IP64. A drip-proof model suitable for use in processes involving moisture. ■Compatible with surface coatings that respond to special chemical solutions. *For more details, please refer to the PDF document or feel free to contact us.

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Wafer transport robot for vacuum environments 'UT-VFX4000NM'

High mobility single-arm vacuum robot for ~300mm wafers!

■High mobility single-arm vacuum robot capable of transporting heavy items such as masks, susceptors, and trays. *For more details, please feel free to contact us.

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Atmospheric Environment Wafer Transport Robot 'UTW-REH5500'

High-speed transport for 300mm wafers! A wafer transport robot that contributes to improving the throughput of the equipment.

■High-speed model wafer transport robot Contributes to improving the throughput of equipment with high-speed transport of 450 WPH. The semiconductor clean robot "ACTRANS series" provides various solutions for customers' semiconductor manufacturing with high performance backed by technology and excellent support through a global network.

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Wafer transport robot for vacuum environments 'UT-VFX3000NM Series'

Single-arm vacuum robot for ~300mm wafers, with options for arm length and presence of Z-axis.

■Standard support for two types of arm lengths. You can also choose whether or not to include the Z-axis, allowing for various device layouts. *For more details, please refer to the PDF document or feel free to contact us.*

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Atmospheric Environment Wafer Transport Robot 'UT-AFX/W3000NM'

【For ~300mm wafers】Significantly reduced internal and external cables of the robot body! Wafer transport robot equipped with power line communication technology.

■ By utilizing high-speed power line communication technology in the wiring design, the internal and external cables of the robot body have been significantly reduced compared to conventional models, thereby lowering the risk of cable disconnection. ■ A variety of options are available, including load sensors, mapping sensors, and slide axes. ■ The integration of the servo amplifier into the robot has allowed for a more compact controller. * For more details, please refer to the PDF document or feel free to contact us.

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Vacuum Environment Wafer Transport Robot 'UT-VDW3000HS Series'

【For ~300mm wafers】World-class high-speed transport in a vacuum! Achieves significant improvement in device throughput with a high-speed, low-vibration double-arm vacuum robot.

■Achieves world-class high-speed transport (650 WPH) in a vacuum ■Significantly reduces vibration during arm operation with the incorporation of a direct drive motor ■Uses a steel belt in the arm section to improve trajectory accuracy and positioning precision ■Employs high-friction pads in the hand section to prevent wafer transport misalignment ■Equipped with a wafer center position offset correction function *For more details, please feel free to contact us.

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Atmospheric Environment Wafer Transport Robot 'UT-AFX/W4000NM'

【For ~300mm wafers】 High mobility transport and wide-range operation possible! The high-speed power line communication technology reduces the number of internal wiring in the robot body and the number of external cables.

■ By utilizing high-speed power line communication technology, the number of internal wiring and external cables in the robot body has been significantly reduced. ■ By integrating the servo amplifier into the robot, the controller has been miniaturized. ■ Due to the capability of high portable transport (total mass of hand holder, hand, and transport work is 4kg), the implementation of a reversing axis has been achieved. It is capable of tape frame wafer transport, bonded wafer transport, and reticle transport. ■ Work gripping can accommodate three methods: vacuum suction, edge clamp using pneumatic pressure, and Bernoulli method. ■ The Bernoulli hand is expected to support contact gripping of the back surface of the outer circumference of TAIKO wafers. * For more details, please refer to the PDF materials or feel free to contact us.

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